| PART |
Description |
Maker |
| NHD-C12864A1Z-FS-FBW-HT1 |
COG (Chip-On-Glass) Liquid Crystal Display Module
|
Newhaven Display Intern...
|
| NHD-C0216CZ-FSW-FBW-3V3 |
COG (Chip-on-Glass) Liquid Crystal Display Module
|
Newhaven Display Intern...
|
| DSF20060SF60 DSF20060SF DSF20060SF55 DSF20060SF56 |
Fast Recovery Diode
Chip-on-Glass (COG) Technology, 16 Characters x 2 Lines 620 A, 5500 V, SILICON, RECTIFIER DIODE
|
DYNEX SEMICONDUCTOR LTD
DYNEX[Dynex Semiconductor]
Dynex Semiconductor, Ltd.
|
| TC-26 |
TUNING FORK QU ARTZ CRY STAL
|
RSG Electronic Components GmbH
|
| TB-39 |
HIGH FREQUENCY MINIATURE CRY STAL UNITS
|
RSG Electronic Components GmbH
|
| 85922-101 |
BODY MALT LIQUID CRYSTAL POLYMER 30% GLASS FLAME RETARDANT ACC UL 94-VO
|
FCI connector
|
| 5962R9582501QEC 5962R9582501QXC 5962R9582501VEC 59 |
Radiation Hardened 3-Line to 8-Line Decoder/Demultiplexer 辐射加固3线至8线译码器/解复用器
150 PF 5% 50V NPO/COG (0805) CHIP CAP TR
From old datasheet system
|
Intersil, Corp.
INTERSIL[Intersil Corporation]
|
| THM322020S-10 THM322020S-80 THM322020SG-10 THM3220 |
Chip-on-Glass (COG) Technology, 16 Characters x 2 Lines
2097152 WORDS x 32 BIT DYNAMIC RAM MODULE
2,097,152 WORDS x 32 BIT DYNAMIC RAM MODULE
2/097/152 WORDS x 32 BIT DYNAMIC RAM MODULE
|
Toshiba Corporation
TOSHIBA[Toshiba Semiconductor]
|
| 43650-0606 3650-0308 |
Multipole Connector; Body Material:LCP Liquid Crystal Polymer, Glass-filled 6 CONTACT(S), FEMALE, RIGHT ANGLE TWO PART BOARD CONNECTOR, SURFACE MOUNT
3
|
Molex, Inc.
|
| ACM4004E CM4004E ACM4004E-FLGH-T ACM4004E-NLBH-T A |
2.7-5.5V; 40characters x 4lines; dot size:0.50x0.55mm; character pitch:2.78x4.89mm; liquid crystal display
SPECIFICATIONS FOR LIQUID CRYSTAL DISPLAY
|
AZDISPLAYS[AZ Displays]
AZ Displays, Inc.
|
| ACM1602S ACM1602S-FLBH-T ACM1602S-FLBS-T ACM1602S- |
2.7-5.5V; 16characters x 2lines; dot size:1.05x1.20mm; liquid crystal display
SPECIFICATIONS FOR LIQUID CRYSTAL DISPLAY
|
AZDISPLAYS[AZ Displays]
|
